The lead-free nickel free white and bright nickel substitute plating process is able to ensure silver white and bright nickel free bright nickel substitute alloy deposits, with advantages as follows: Soft plating deposits and good leveling, excellent covering ability, high hardness and good corrosion proof ability; It can be directly used on the copper and its alloy, and also as bottom deposits for other plating. This process is an epoch-making environment-friendly process, no heavy metal lead in any additives. Plating deposits is silver white color, suitable for bottom deposits for electrophoretic paint. Deposits temperature resistant up to 140°C, and good soldering performance ; Deposits meet EU strict regulation. This plating technology, Han Lin may have declared national patent, please use it correctly.